Mitsui Mining & Smelting has patented a bonding sheet featuring a copper foil with sinterable bonding films on both sides. These films, containing copper particles and a solid reducing agent, facilitate bonding to objects with gold, silver, copper, or nickel surfaces, ensuring electrical connectivity. GlobalData’s report on Mitsui Mining & Smelting gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Mitsui Mining & Smelting, Hydrogen storage alloys was a key innovation area identified from patents. Mitsui Mining & Smelting's grant share as of June 2024 was 47%. Grant share is based on the ratio of number of grants to total number of patents.
Bonding sheet with copper foil and sinterable bonding films
The patent US12046572B2 describes a bonding sheet designed for use in electronic and semiconductor applications. The bonding sheet consists of a copper foil that contains at least 97 mass % copper, with sinterable bonding films applied to both faces. These bonding films are composed of copper particles and a solid reducing agent, which is specified as an amino alcohol compound in one of the claims. The bonding sheet is intended to bond to a target object that has a surface coated with at least one metal selected from gold, silver, copper, or nickel. The copper foil's thickness ranges from 0.5 µm to 1000 µm, allowing for versatility in various applications.
Additionally, the patent outlines a bonded structure that incorporates the bonding sheet. This structure includes two bonded objects, each having a metal surface from the specified group, and a composite bonding layer that features the copper foil and bonding layers on either side. These layers consist of a sintered structure of copper particles, facilitating electrical connections between the bonded objects. The claims also allow for the inclusion of a third bonded object, such as a semiconductor element, which can be interposed between the first and second bonded objects, maintaining electrical connectivity through the bonding layers. The emphasis on high copper content in the foil and the specific materials used in the bonding films highlights the patent's focus on enhancing electrical performance and reliability in bonded electronic structures.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
