Mitsubishi Materials has filed a patent for a copper alloy plastically-worked material with specific composition and properties. The material contains 10-100 mass ppm of Mg and a balance of Cu and impurities, with limited amounts of S, P, Se, Te, Sb, Bi, and As. The mass ratio of Mg to impurities is 0.6 or greater and 50 or less. The material has high electrical conductivity (97% IACS or greater), low tensile strength (275 MPa or less), and good heat resistance (150°C or higher after draw working). GlobalData’s report on Mitsubishi Materials gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Copper alloy material with specific composition for plastically-worked applications
A recently filed patent (Publication Number: US20230313341A1) describes a copper alloy plastically-worked material with specific properties and compositions. The material consists of copper (Cu) and magnesium (Mg) in a range of greater than 10 mass ppm and 100 mass ppm or less. The alloy also contains inevitable impurities such as sulfur (S), phosphorus (P), selenium (Se), tellurium (Te), antimony (Sb), bismuth (Bi), and arsenic (As) in amounts of 10 mass ppm or less individually, with a total impurity content of 30 mass ppm or less. The mass ratio of Mg to the total impurities should be between 0.6 and 50. The material exhibits high electrical conductivity of 97% IACS or greater and a tensile strength of 275 MPa or less. It also has a heat-resistant temperature of 150°C or higher after undergoing draw working with a cross-section reduction ratio of 25%.
Claim 2 specifies that the tensile strength of the copper alloy plastically-worked material should be 250 MPa or less. Claim 3 states that the cross-sectional area of the material should be between 5 mm2 and 2,000 mm2. Claim 4 requires a total elongation of 20% or greater. Claim 5 allows for the addition of silver (Ag) in a range of 5 mass ppm to 20 mass ppm. Claim 6 includes additional impurities such as hydrogen (H), oxygen (O), and carbon (C) in amounts of 10 mass ppm or less.
Claim 7 describes a method for analyzing the crystal grain structure of the material using an Electron Backscatter Diffraction (EBSD) method. The average grain size should be 1.8 or less according to Kernel Average Misorientation (KAM) values. Claim 8 specifies that the material should have an area ratio of crystals with (100) plane orientation of 3% or greater and an area ratio of crystals with (123) plane orientation of 70% or less. Claim 9 defines the average crystal grain size in the surface layer region of the material to be between 1 µm and 120 µm.
Claim 10 introduces a copper alloy rod material that includes the previously described plastically-worked material, with a diameter ranging from 3 mm to 50 mm. Claim 11 and Claim 12 describe the use of the copper alloy plastically-worked material in electronic/electrical devices and terminals, respectively.
In summary, the patent describes a copper alloy plastically-worked material with specific compositions and properties, including high electrical conductivity, low tensile strength, and heat resistance. The material can be used in various applications, including electronic/electrical devices and terminals.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies
