Materion has patented a superconducting wire featuring a Ta alloy diffusion barrier that enhances mechanical strength and resists internal diffusion. The wire includes a copper stabilizing matrix and composite filaments with Nb-based monofilaments, with the diffusion barrier occupying 2%-15% of the wire’s cross-sectional area. GlobalData’s report on Materion gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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According to GlobalData’s company profile on Materion, Ceramic composite laminates was a key innovation area identified from patents. Materion's grant share as of July 2024 was 54%. Grant share is based on the ratio of number of grants to total number of patents.

Superconducting wire with ta alloy diffusion barriers

Source: United States Patent and Trademark Office (USPTO). Credit: Materion Corp

The granted patent US12073958B2 describes a novel superconducting wire designed to enhance performance through a multi-layered structure. The wire features an inner wire stabilizing matrix made of copper (Cu) and is encased in a diffusion barrier composed of a tantalum-tungsten (Ta-3W) alloy, which may include additional alloying elements such as ruthenium (Ru), platinum (Pt), palladium (Pd), and others. Surrounding this diffusion barrier are composite filaments that consist of niobium (Nb)-based monofilaments encased in a Cu cladding. The diffusion barrier is specified to occupy 2% to 15% of the wire's cross-sectional area and extends along the wire's axial dimension, contributing to the wire's stability and superconducting properties.

Further claims detail the composition of the monofilaments, which may include various combinations of Nb with elements like titanium (Ti), zirconium (Zr), and tin (Sn). The patent also introduces the concept of a stabilizing element, which can be made from tantalum or its alloys, positioned at the wire's radial center and occupying a minimal cross-sectional area (between 1% and 20%). This stabilizing element is crucial for maintaining the wire's structural integrity while enhancing its superconducting capabilities. The claims also allow for variations in the cross-sectional shape of the filaments, indicating a focus on optimizing the wire's performance characteristics.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.